Patent Working Paper (Sample Excerpt)

Publication: CN108765432A — Semiconductor package heat dissipation structure

Not formal legal advice.

Independent Claim in Plain Language

Focus on independent claim 1: a package substrate, chip die, and thermally conductive bridge connecting die top surface to a heat spreader with defined contact area ratio.

Key Takeaways

• Boundary is defined by structural contact ratio, not generic "better cooling".
• Cross-check figures for bridge geometry before relying on translation.